pcb_guideline
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pcb_guideline [2015/02/09 15:50] – created sdolt | pcb_guideline [2015/02/09 15:54] – sdolt | ||
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From Kicad Library Convention 0.8 - 19.01.2015 | From Kicad Library Convention 0.8 - 19.01.2015 | ||
- | 1. General Rules | + | ===== General Rules ===== |
- | ---------------- | + | |
- | 1.1. | + | * Writing uses C-style naming with the first letter of each word being capitalized. Ex: " |
- | 1.2. Every acronym has all of its letters capitalized. | + | |
- | 1.3. | + | |
- | 1.4. When dimensions are used in part name, they are in millimeters, | + | |
- | 1.5. | + | |
- | 1.6. The order of elements in names must be the same as the enumerations presented in this document. | + | |
- | 2. Symbol Library Names (.lib files) | + | ===== 2. Symbol Library Names ===== |
- | ------------------------------------ | + | |
- | 2.1. | + | |
- | 2.2. | + | - |
- | 3. General Rules for Symbols | + | ===== 3. General Rules for Symbols |
- | ---------------------------- | + | |
3.1. Using a 100mil grid, pin ends and origin must lie on grid nodes (IEC-60617). | 3.1. Using a 100mil grid, pin ends and origin must lie on grid nodes (IEC-60617). | ||
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- | 4. Symbol Names | + | ===== 4. Symbol Names ===== |
- | --------------- | + | |
4.1. Name of symbol, may be shortened for common components or use reference designator of the symbol (IEEE 315-1975). ex: " | 4.1. Name of symbol, may be shortened for common components or use reference designator of the symbol (IEEE 315-1975). ex: " | ||
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- | 5. Footprint Library Names (.pretty repositories) | + | ===== 5. Footprint Library Names ===== |
- | ------------------------------------------------- | + | |
5.1. Part type (resistor, cap, etc), must be in plural form. | 5.1. Part type (resistor, cap, etc), must be in plural form. | ||
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- | 6. General Rules for Footprints | + | ===== 6. General Rules for Footprints |
- | ------------------------------- | + | |
6.1. Follows datasheet recommendation unless intentional variation, for example longer pads for hand soldering. | 6.1. Follows datasheet recommendation unless intentional variation, for example longer pads for hand soldering. | ||
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- | 7. Names for footprints of Surface-Mount Devices (SMD) | + | ===== 7. Names for footprints of Surface-Mount Devices (SMD) ===== |
- | ------------------------------------------------------ | + | |
7.1. Specific package feature first, not separated by anything. Ex: " | 7.1. Specific package feature first, not separated by anything. Ex: " | ||
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- | 8. Names for footprints of common devices, such as resistors, capacitors, etc | + | ===== 8. Names for footprints of common devices, such as resistors, capacitors, etc ===== |
- | ----------------------------------------------------------------------------- | + | |
8.1. Name of part, may be shortened for common components. ex: " | 8.1. Name of part, may be shortened for common components. ex: " | ||
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- | 9. Names for footprints of specific devices | + | ===== 9. Names for footprints of specific devices |
- | ------------------------------------------- | + | |
9.1. Name of part. | 9.1. Name of part. | ||
9.2. Part number. Ex: " | 9.2. Part number. Ex: " | ||
9.4. Any modification to the original footprint, indicated by appending the reason. | 9.4. Any modification to the original footprint, indicated by appending the reason. |
pcb_guideline.txt · Last modified: 2015/02/09 16:03 by sdolt