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pcb_guideline [2015/02/09 15:53] – sdoltpcb_guideline [2015/02/09 16:02] – sdolt
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 From Kicad Library Convention 0.8 - 19.01.2015 From Kicad Library Convention 0.8 - 19.01.2015
  
-===== 1. General Rules =====+===== General Rules =====
  
- -  Writing uses C-style naming with the first letter of each word being capitalized. Ex:    "Socket_Strip_Straight_2x06" +  * Writing uses C-style naming with the first letter of each word being capitalized. Ex:    "Socket_Strip_Straight_2x06" 
- -  Every acronym has all of its letters capitalized. +  * Every acronym has all of its letters capitalized. 
- -  Manufacturer name is capitalized as usual. Ex: NEC, Microchip +  * Manufacturer name is capitalized as usual. Ex: NEC, Microchip 
- -  When dimensions are used in part name, they are in millimeters, decimal places separated by a dot, and unit is not capitalized. Ex: "Cap_10x13mm_RM5" +  * When dimensions are used in part name, they are in millimeters, decimal places separated by a dot, and unit is not capitalized. Ex: "Cap_10x13mm_RM5" 
- -  Filename is the same as the part name. +  * Filename is the same as the part name. 
- -  The order of elements in names must be the same as the enumerations presented in this document.+  * The order of elements in names must be the same as the enumerations presented in this document.
  
  
-===== 2. Symbol Library Names =====+===== Symbol Library Names =====
  
- -  Manufacturer. +  * Manufacturer. 
- -  Category or family of parts. ex: "Capacitors", "Spartan6", etc.+  * Category or family of parts. ex: "Capacitors", "Spartan6", etc.
  
  
-===== 3. General Rules for Symbols =====+===== General Rules for Symbols =====
  
-3.1.  Using a 100mil grid, pin ends and origin must lie on grid nodes (IEC-60617). +  * Using a 100mil grid, pin ends and origin must lie on grid nodes (IEC-60617). 
-3.2.  Pin has a length of 100mil or more in increments of 50mil if number needs more space. +  * Pin has a length of 100mil or more in increments of 50mil if number needs more space. 
-3.3.  Origin is placed in the middle of symbol. +  * Origin is placed in the middle of symbol. 
-3.4.  Black-box components group pins logically, for example by function set, and ports in counter-clockwise position. +  * Black-box components group pins logically, for example by function set, and ports in counter-clockwise position. 
-3.5.  Whenever possible, inputs are on the left and outputs are on the right. +  * Whenever possible, inputs are on the left and outputs are on the right. 
-3.6.  Field text uses a common size of 50mils. +  *  Field text uses a common size of 50mils. 
-3.7.  The reference field is prefilled with the reference designator of the symbol (IEEE 315-1975). +  * The reference field is prefilled with the reference designator of the symbol (IEEE 315-1975). 
-3.8.  The Value field is prefilled with the object name.+  * The Value field is prefilled with the object name.
  
 +===== Symbol Names =====
  
-===== 4. Symbol Names =====+  * Name of symbol, may be shortened for common components or use reference designator of the symbol (IEEE 315-1975). ex: "Conn_4x2", "C", etc. 
 +  * Manufacturer. 
 +  * Part number, including extension for specific footprint. (JEDEC for common devices, ex: 1N4001) 
 +  * Any modification to the original symbol, indicated by appending the reason. Ex: different pin ordering: "Transistor_PNP_Pinswap1" 
 +  * Indication of quantity if symbol is an array. ex: resistor array: "Resistor_x8"
  
-4.1.  Name of symbol, may be shortened for common components or use reference designator of the symbol (IEEE 315-1975). ex: "Conn_4x2", "C", etc. +===== Footprint Library Names =====
-4.2.  Manufacturer. +
-4.3.  Part number, including extension for specific footprint. (JEDEC for common devices, ex: 1N4001) +
-4.4.  Any modification to the original symbol, indicated by appending the reason. Ex: different pin ordering: "Transistor_PNP_Pinswap1" +
-4.5.  Indication of quantity if symbol is an array. ex: resistor array: "Resistor_x8"+
  
 +  * Part type (resistor, cap, etc), must be in plural form.
 +  * Package type (SOIC, SMD, etc).
 +  * Manufacturer.
 +  * Part number.
  
-===== 5. Footprint Library Names =====+===== General Rules for Footprints =====
  
-5.1.  Part type (resistor, cap, etc), must be in plural form. +  * Follows datasheet recommendation unless intentional variation, for example longer pads for hand soldering. 
-5.2.  Package type (SOIC, SMD, etc). +  * Pad 1 is on the left first, then at the top, except at the top for PLCC (IPC-7351). 
-5.3.  Manufacturer. +  * For through-hole components, footprint anchor is set on pad 1. 
-5.4.  Part number.+  * For surface-mount devices, footprint anchor is placed in the middle with respect to device lead ends. (IPC-7351) 
 +  * Silkscreen is not superposed to pads, its outline is completely visible after board assembly, uses 0.15mm line width and provides a reference mark for pin 1. (IPC-7351) 
 +  * Courtyard line has a width 0.05mm. This line is placed so that its clearance is measured from its center to the edges of pads and body, and its position is rounded on a grid of 0.05mm. 
 +  * Courtyard clearance is 0.25mm except for components smaller than 0603 at 0.15mm, connectors, SMD canned capacitors and crystals at 0.5mm and BGA at 1.0mm. (IPC-7251, IPC-7351B) 
 +  * Cannot be duplicated to match a different pin ordering. This is to be handled in the symbol libraries. 
 +  * Footprint name must match its filename. (.kicad_mod files) 
 +  * The value and reference designator must be placed on silkscreen.
  
 +===== Names for footprints of Surface-Mount Devices (SMD) =====
  
-===== 6. General Rules for Footprints =====+  * Specific package feature first, not separated by anything. Ex: "TSSOP" 
 +  * Package name, numbers separated from letters using hyphen. Ex: "SOT-89" 
 +  * Variation of package, separated by another hyphen. Ex: SOT-23 with 5 pins: "SOT-23-5", Exposed pad under package: "QFP-48-1EP" 
 +  * If it's a manufacturer-specific package, name can be appended, separated by an underscore. 
 +  * Any modification to the original footprint, indicated by appending the reason. Ex: longer pads used to facilitate hand soldering of a QFN component: "QFN-52_HandSoldering"
  
-6.1.  Follows datasheet recommendation unless intentional variation, for example longer pads for hand soldering. +===== Names for footprints of common devices, such as resistors, capacitors, etc =====
-6.2.  Pad 1 is on the left first, then at the top, except at the top for PLCC (IPC-7351). +
-6.3.  For through-hole components, footprint anchor is set on pad 1. +
-6.4.  For surface-mount devices, footprint anchor is placed in the middle with respect to device lead ends. (IPC-7351) +
-6.5.  Silkscreen is not superposed to pads, its outline is completely visible after board assembly, uses 0.15mm line width and provides a reference mark for pin 1. (IPC-7351) +
-6.6.  Courtyard line has a width 0.05mm. This line is placed so that its clearance is measured from its center to the edges of pads and body, and its position is rounded on a grid of 0.05mm. +
-6.7.  Courtyard clearance is 0.25mm except for components smaller than 0603 at 0.15mm, connectors, SMD canned capacitors and crystals at 0.5mm and BGA at 1.0mm. (IPC-7251, IPC-7351B) +
-6.8.  Cannot be duplicated to match a different pin ordering. This is to be handled in the symbol libraries. +
-6.9.  Footprint name must match its filename. (.kicad_mod files) +
-6.10. The value and reference designator must be placed on silkscreen.+
  
 +  * Name of part, may be shortened for common components. ex: "Cap", "Socket_Strip", etc.
 +  * Dimension, which may include at its end the positioning. Ex: "5x7mm_Horiz", "1x02_Angled"
 +  * Pad distance, in the form of an RM rating.
 +  * Any modification to the original footprint, indicated by appending the reason.
  
-===== 7. Names for footprints of Surface-Mount Devices (SMD) =====+===== Names for footprints of specific devices =====
  
-7.1.  Specific package feature first, not separated by anything. Ex: "TSSOP" +  * Name of part. 
-7.2.  Package name, numbers separated from letters using hyphen. Ex: "SOT-89" +  * Part number. Ex: "Oscillator_SI570" 
-7.3.  Variation of package, separated by another hyphen. Ex: SOT-23 with 5 pins: "SOT-23-5", Exposed pad under package: "QFP-48-1EP" +  * Any modification to the original footprint, indicated by appending the reason.
-7.4.  If it's a manufacturer-specific package, name can be appended, separated by an underscore. +
-7.5.  Any modification to the original footprint, indicated by appending the reason. Ex: longer pads used to facilitate hand soldering of a QFN component: "QFN-52_HandSoldering" +
- +
- +
-===== 8. Names for footprints of common devices, such as resistors, capacitors, etc ===== +
- +
-8.1.  Name of part, may be shortened for common components. ex: "Cap", "Socket_Strip", etc. +
-8.2.  Dimension, which may include at its end the positioning. Ex: "5x7mm_Horiz", "1x02_Angled" +
-8.3.  Pad distance, in the form of an RM rating. +
-8.4.  Any modification to the original footprint, indicated by appending the reason. +
- +
- +
-===== 9. Names for footprints of specific devices ===== +
- +
-9.1.  Name of part. +
-9.2.  Part number. Ex: "Oscillator_SI570" +
-9.4.  Any modification to the original footprint, indicated by appending the reason.+
pcb_guideline.txt · Last modified: 2015/02/09 16:03 by sdolt